May 25, 2018

Xiaomi Mi 8 Box Package and Front Panel Appears in Freshly Leaked Photos

Xiaomi Mi 8 Box Package and Front Panel Appears in Freshly Leaked Photos

A new report has revealed that Xiaomi’s Shenzhen evnet will be held on May 31. Multiple leaks that have surfaced in the recent past have revealed that Xiaomi may debut the Mi 8 Anniversary Edition smartphone. It might even arrive with Xiaomi Mi 8 moniker. Today, a leaked photo showing the black-colored box package with number 8 mentioned has surfaced today. Also, another leak has revealed the front panel of the Xiaomi Mi 8 smartphone.

The box package in the above image is yet another proof that Xiaomi is prepping up to launch the rumored Xiaomi Mi 8 smartphone. The image shows a front panel placed inside a plastic cover with Xiaomi Mi 8 mentioned over it. What’s interesting about this leak is that it clearly shows the wide notch at the top that is most likely to house the structured light 3D module for 3D facial recognition. The image reveals that the Mi 8 will be sporting slimmer side bezels and a slightly thicker chin.

Xiaomi Mi 8 Box Package and Front Panel Appears in Freshly Leaked Photos

There is no information available on the specifications of the Xiaomi Mi 8. Since it is expected to arrive as a flagship phone, it will be driven by Snapdragon 845. The handset is also speculated to feature an OLED display. There is a possibility that this advanced smartphone may also feature an under-display fingerprint scanner.

The Shenzhen event that will accommodating around 5,000 people is expected to be the most important product launch for the company this year. Hence, it will be used by the company to introduce multiple devices. Xiaomi is expected to launch the Xiaomi Mi 7 and Mi Band 3 fitness tracker at the same event.

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