It is becoming increasingly plausible that Xiaomi will announce the Mi Mix 2S at MWC 2018. A few renders have revealed a very interesting design of the Mi Mix 2S with a notch. A new leak has now shed some light on what could be possible design and specifications of the upcoming flagship smartphone from Xiaomi.
The leaked image shows off a similar odd placement of the front-facing camera. Also, the leak claims that the fingerprint sensor will be placed under the display which, seems a bit unlikely. The bezels are even around the display and the top bezel also houses a small earpiece. To the back, it will have a four-sided curved ceramic unibody.
The leak also reiterates that the Mi Mix 2S will be the first device to be powered by the Qualcomm Snapdragon 845 chipset. Even if the device does have the Snapdragon 845 chipset, it might not be the first one as Samsung will launch the Galaxy S9 and S9+ on the 25th of February. Along with the Snapdragon 845 chipset, it will have an 8GB LPDDR4X RAM along with 256GB of onboard storage.